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The unpackaged chip is literally a chip process that does not involve the packaging factory. In fact, it is only the chip factory that has done the work of the packaging factory.
The industry said that there is no big cost advantage for unpackaged chips, and the market share is not large. But in turn there is no big market, and naturally there is no cost reduction brought about by the scale effect. We can't deny that it is the technology trend of the next package.
At present, there is a high-voltage linear constant current driving method in the power supply industry, which is also a combination of the power source and the light source that we have traditionally seen. This unpackaged chip also integrates the chip and package.
In recent years, many new technologies such as light engines and LED integrated lights have also been integrated into the concept. Tian Jie, manager of Zhuo Nai Marketing Center, said that the biggest advantage of integration lies in the reduction of devices and the reduction of final cost.
Integration makes the boundaries between upstream and downstream less clear. Tang Guoqing said that if the large-area promotion of unpackaged chips will make the boundaries between the packaging factory and the chip factory less clear.
Chen Zhengyan believes that the package-free technology is a technology integration. The packaging process includes wire bonding, phosphor coating, heat treatment, electrical connection, etc. The package-free package represents the chip and can be sent to the lighting factory for use. The packaging plant will no longer be downstream of the chip factory, but affiliated.
However, Tang Guoqing does not agree with this view. Although it is only necessary to attach the aluminum substrate, it is not without technical requirements. The industry has a specialization, and the advantage of the chip factory is still the extension process. At present, Samsung led has no related products, but he believes that if the pure chip factory that did not package before produces the package-free chips, more will consider the packaging factory OEM and will not do it by itself. However, it is not ruled out that in the future, lighting companies will buy their own equipment and use their own bare die to attach aluminum substrates.
A deputy general manager of a packaging factory in Shenzhen said that if this package-free chip is fully promoted, the packaging factory can only be ready to go out of business. Because this live if the chip factory really does not want to do, the downstream lighting factory can also do a few equipment. This point Zheng Tiemin said that he said that many lighting factories now have the ability to directly package the die of the chip factory, as long as they buy equipment. But he believes that most of the packaging plants now have their own lighting production lines, so the impact will not be too great.
Gong Wen, general manager of Jingtai Optoelectronics, believes that there should be thousands of packaging devices in operation around the world. Even if the package-free chips are widely promoted, such a large package capacity cannot be completely disappeared. But he also very much agrees with the concept of integration. COB's next step in research and development is to integrate the power supply and control system into a chip-level way. It can be used after power-on, which will save costs, such as IC manufacturing. cost. At the same time, this method is more convenient and more reliable.
composed of storage tanks, batching, mixing, vacuum, mould, and computerized controlling systems. It can be realized
numerical control during the whole production. It is used for making all kinds of foam.
Advantage: *The volume of the foam size can be 30% increasing at the same foaming formula.
* Reduce the chemical consumption and production cost.
* Suction and filtrate the foaming air. Environmental Protection.
* Monitoring the whole process of foaming by CCTV .
* Base plate can be Lifting automatically: it makes the sponge with uniform density and flat top by using
this way.
* Easy cleaning function.
* It can be realized numerical control with accurate and convenient ration during the whole production. And
it becomes more easily and stable to operate the machine
. * Continuous foaming.
* Flat top pressing device.(Additional)